1. General
1.1. Scope
This document describes the design rules for IHPs SG13G2 SiGe BiCMOS technology.
1.2. List of abbreviations
Abbreviation |
Explanation |
|---|---|
BiCMOS |
BipolarCMOS |
HBT |
HeterojunctionBipolarTransistor |
IC |
IntegratedCircuit |
IHP |
InnovationsforHighPerformanceMicroelectronics |
MIM |
Metal-Insulator-Metal |
NMOS |
NegativeChannelMetalOxideSemiconductor |
PMOS |
PositiveChannelMetalOxideSemiconductor |
RD |
ReferenceDocument |
SiGe |
SiliconGermanium |
1.3. Layout Information
Note
1.1 The layout guidelines outlined in this document are stated in micrometers (μm).
1.2 All dimensions depicted in drawings correspond to the final silicon dimensions.
1.3 None of the drawings or schematics in this document are drawn to proportional scale.
1.4 Unless specified otherwise, all dimensions provided herein are considered to be minimum requirements.
1.4. Reference documents
[RD 1] IHP SG13G2 Process specification Rev. 1.3