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    IHP-GmbH/IHP-Open-PDK
        • 1.1. Reference Libraries
        • 1.2. Technology Libraries
        • 1.3. Creating New Libraries
          • 1.4.1. Available Cells
          • 1.4.2. Output Drive Strength
          • 1.4.3. Choosing the Right Drive Strength
          • 1.4.4. Pin Interface
        • 1.1. Build tools
        • 1.2. Useful tools
        • 1.3. Build dependencies
        • 2.1. Requirements
        • 2.2. Cloning
        • 2.3. General configuration
        • 2.4. Verilog-A models compilation
        • 2.5. Tool specific configuration
        • 3.1. What the implementation does
        • 3.2. Code references
        • 3.3. Practical takeaway
        • 1.1. Main Processing Sequence and Cross-Section Schematic
          • 1.2.1. Pass/Fail Parameters
          • 1.2.2. Information Parameters
        • 1.3. Wafer Reject Criteria
        • 2.1. NMOS-Specs
        • 2.2. PMOS-Specs
        • 2.3. iNMOS-Specs
        • 2.4. HV-NMOS-Specs
        • 2.5. HV-PMOS-Specs
        • 2.6. HV-iNMOS-Specs
        • 2.7. Rsil-Specs
        • 2.8. Rppd-Specs
        • 2.9. Rhigh-Specs
        • 2.10. Schottky_nbl1-Specs
        • 2.11. S-Varicap-Specs
        • 2.12. MIM Capacitor-Specs
        • 2.13. Resistances, Line Width Deltas, Temperature Coefficients
        • 2.14. Contact & Via Resistances
        • 2.15. Maximum Current Densities
        • 2.16. Layer Thickness Values
        • 2.17. Parasitic Capacitances
        • 3.1. npn13g2-Specs
        • 3.2. npn13g2l-Specs
        • 3.3. npn13g2v-Specs
      • 4. Attachment A: Measurement Conditions
      • 5. Change History
      • 6. Known Issues
        • 1.1. Scope
        • 1.2. List of abbreviations
        • 1.3. Layout Information
        • 1.4. Reference documents
      • 2. Layer Table
      • 1. Analog/Mixed/RF flow
        • 2.1. XSCHEM installation and configuration
        • 2.2. XSCHEM symbol library
        • 2.3. XSCHEM testcases
        • 2.4. XSCHEM standard cell library
        • 2.5. XSCHEM IO cell library
        • 3.1. Adding a new library and objects to Qucs-S via XML interface
        • 3.2. Using Qucs-S with IHP-Open-PDK
        • 4.1. NGSPICE installation
        • 4.2. NGSPICE basic testcases
          • 5.1.1. Trilinos installation
          • 5.1.2. ADMS installation
          • 5.1.3. XYCE installation
        • 6.1. Introduction to Gnucap
        • 6.2. Gnucap and gnucap-modelgen-verilog installation on ubuntu 22.04 LTS
        • 6.3. Gnucap basic example
        • 6.4. Compiling a Verilog-A model to be used in a simulation
        • 6.5. References
        • 7.1. Pygmid installation and configuration
        • 7.2. Device characterization using pygmid
        • 7.3. Basic usage of pygmid
      • 8. Analog design using KLayout tool
        • 9.1. Advantages over manual layout
        • 9.2. Getting started
      • With OpenROAD
        • Prerequisites
        • Quick Start
          • Automatic PDK Management (Recommended)
          • Manual PDK Installation (Optional)
        • Next Steps
        • Additional Resources
        • Creating the Files
        • Running the Flow
          • Using OpenROAD GUI
          • Using KLayout
        • Discover the run/ Directory
        • Further Resources
      • Full Chip Design With Librelane
      • 1. Filler Generation
        • 2.1. Controlling Metal Filler Densities
        • 2.2. Verification
        • 3.1. Installation
        • 3.2. Density
        • 3.3. Erase
        • 3.4. Fill
        • 3.5. Custom Configuration
          • 1.1. Activ (not in BEOL)
          • 1.2. Activ Filler (not in BEOL)
          • 1.3. Thick Gate Oxide (not in BEOL)
          • 1.4. GatPoly (not in BEOL)
          • 1.5. GatPoly Filler (not in BEOL)
          • 1.6. Cont (not in BEOL)
          • 1.7. Metal
          • 1.8. Metal Filler
          • 1.9. Via
          • 1.10. TopVia1
          • 1.11. TopMetal1
          • 1.12. TopVia2
          • 1.13. TopMetal2
          • 1.14. TopMetal Filler
          • 1.15. Passiv
          • 1.16. Density rules
          • 1.17. LBE
          • 1.18. Pad Dimensions
          • 1.19. Sealring
          • 1.20. Pin layer rules
          • 1.21. Forbidden layers
        • 2. Main DRC rules
        • 3. Extra DRC rules
          • 4.1. Folder Structure
          • 4.2. Prerequisites
          • 4.3. Installation
          • 4.4. Usage
          • 4.5. DRC Testing
        • 5. TODO: verification/drc/magic
          • 1.1. Purpose
          • 1.2. Abbreviations
          • 1.3. Derived Layers
          • 1.4. Glossary of Terms
          • 2.1. Layers Definition
          • 2.2. Layout Layers
        • 3. Truth Table for SG13G2 SiGe BiCMOS Process
          • 4.1. MOSFET Devices
          • 4.2. RFMOSFET Devices
          • 4.3. BJT Devices
          • 4.4. Diode Devices
          • 4.5. Resistor Devices
          • 4.6. Capacitor Devices
          • 4.7. ESD Devices
          • 4.8. Inductor Devices
          • 4.9. Tap Devices
          • 5.1. Folder Structure
          • 5.2. Prerequisites
          • 5.3. Installation
          • 5.4. Usage
          • 5.5. LVS Testing
        • 6. Magic-LVS
        • With Magic
          • Solver methods
          • Which solver method is better for my model?
          • Workflows using Python model script
          • Graphical user interface: EMStudio
          • Graphical user interface: setupEM
          • Port de-embedding in Palace workflow
          • Port de-embedding in openEMS workflow
          • Lumped model fit
          • Black box vector fit
          • S-parameter viewer in qucs-s
          • Python script „plot_snp“
          • Python script „plot_inductor“
          • gds_removefill
          • gds_simplify
          • gds_prepare_for_EM
          • mpa_core
          • Inductor 400pH @ 40 GHz
          • Butler matrix 93 GHz
          • Stacked Technology using openEMS flow
        • 1.1. Developer Certificate of Origin
        • 1.2. Code reviews
        • 1.3. Community Guidelines
      • 2. Workflow
    • References
    • Show Source

    Chip Finishing¶

    • 1. Filler Generation
    • 2. KLayout
      • 2.1. Controlling Metal Filler Densities
      • 2.2. Verification
    • 3. gdsfill
      • 3.1. Installation
      • 3.2. Density
      • 3.3. Erase
      • 3.4. Fill
      • 3.5. Custom Configuration
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