DRC Rules

IHP Open Source PDK

130nm BiCMOS Technology

IHP-SG13G2

KLayout DRC Rules

Contents

• 1. Precheck (Minimal) DRC rules
  • 1.1. Activ (not in BEOL)
  • 1.2. Activ Filler (not in BEOL)
  • 1.3. Thick Gate Oxide (not in BEOL)
  • 1.4. GatPoly (not in BEOL)
  • 1.5. GatPoly Filler (not in BEOL)
  • 1.6. Cont (not in BEOL)
  • 1.7. Metal
  • 1.8. Metal Filler
  • 1.9. Via
  • 1.10. TopVia1
  • 1.11. TopMetal1
  • 1.12. TopVia2
  • 1.13. TopMetal2
  • 1.14. TopMetal Filler
  • 1.15. Passiv
  • 1.16. Density rules
    • 1.16.1. Front-end density rules
    • 1.16.2. Back-end density rules
  • 1.17. LBE
  • 1.18. Pad Dimensions
    • 1.18.1. Solder Bump Rules
    • 1.18.2. Copper Pillar Rules
  • 1.19. Sealring
  • 1.20. Pin layer rules
  • 1.21. Forbidden layers
• 2. Main DRC rules
• 3. Extra DRC rules
• 4. Klayout-DRC
  • 4.1. Folder Structure
  • 4.2. Prerequisites
  • 4.3. Installation
  • 4.4. Usage
    • 4.4.1. CLI
    • 4.4.2. GUI
  • 4.5. DRC Testing
    • 4.5.1. Folder Structure
    • 4.5.2. Usage Guide
      • 4.5.2.1. Golden Results (For Developers Only)
      • 4.5.2.2. Regression Testing
        • 4.5.2.2.1. DRC Regression Outputs
        • 4.5.2.2.2. 🧾 Output Regression Log
          • 4.5.2.2.2.1. 📋 Sample Regression Output
          • 4.5.2.2.2.2. 📊 Explanation of Result Columns
          • 4.5.2.2.2.3. ✅ Summary Insights
• 5. TODO: verification/drc/magic